Factory Innovation Week Post Show Report

Post Show Report

Date: January 24-26, 2024 

Venue: Tokyo Big Sight, Japan

ABOUT

Exhibition gathering IoT, AI, and Robots for Logistics Innovation

SMART LOGISTICS Expo is an exhibition gathering solutions and innovative technologies for logistics.
It will be the best place to find automation, digitalization and labor-saving solutions in manufacturing/logistics industry.

No. of Exhibitors

Including Concurrent Shows: 

1,688

Exhibitors

No. of Visitors 

Including Concurrent Shows: 

77,744

Visitors

No. of Conference Sessions 

No. of Conference Sessions 

Including Concurrent Shows: 

170

Speakers

Exhibitors Gathered from 25 Countries/Regions

Exhibitors Gathered
from 25
Countries/Regions

  • Australia
  • Austria
  • Canada
  • China
  • Finland
  • France
  • Germany
  • Hong Kong
  • India
  • Israel
  • Italy
  • Japan
  • Madagascar
  • Mexico
  • Netherlands
  • Norway
  • Philippines
  • Poland
  • Singapore
  • South Korea
  • Sweden
  • Switzerland
  • Taiwan
  • United Kingdom
  • United States

Visitors gathered from 58 countries/regions.

Visitors gathered from
58 countries/regions.

  • Australia
  • Austria
  • Belgium
  • Brazil
  • Bulgaria
  • Canada
  • Chile
  • China
  • Cyprus
  • Czechia
  • Denmark
  • Finland
  • France
  • Germany
  • Heard Island And Mcdonald Islands
  • Hong Kong
  • Hungary
  • India
  • Indonesia
  • Iran
  • Iraq
  • Ireland
  • Israel
  • Italy
  • Japan
  • Kazakhstan
  • Korea
  • Kuwait
  • Lithuania
  • Malaysia
  • Mexico
  • Mongolia
  • Mozambique
  • Namibia
  • Netherlands
  • New Zealand
  • Pakistan
  • Panama
  • Philippines
  • Poland
  • Romania
  • Singapore
  • Slovenia
  • South Africa
  • Spain
  • Sri Lanka
  • Sweden
  • Switzerland
  • Taiwan
  • Tanzania
  • Thailand
  • Tunisia
  • Türkiye
  • United Arab Emirates
  • United Kingdom
  • United States
  • Uzbekistan
  • Viet Nam

Conference Speakers (excerpts)

Keynote Session

NX Group's Thoughts on "The Tole That Logistics DX Plays in Solving Sustainability Issues"

Atsushi Tenpaku

Executive Officer in charge of DX Promotion Dept. and
General Manager of DX Promotion Dept.
Nippon Express Co., Ltd.

Logistics Innovation towards 2030
 
 

Masashi Onozuka

Partner,



Roland Berger Ltd.


Special & Technical Sessions

Latest Technological Trends in Electrified Products for the Full-scale Spread of xEVs

Natsuki Nozawa

General Manager, Electrification Components Div.,



DENSO Corp.

Current Status and Future Trends of Power Semiconductor Modules  
 

Toru Hosen

Director, Senior Managing Executive Officer and Corporate General Manager of the Semiconductors Business Group,

Fuji Electric Co., Ltd.

Next-generation Semiconductors for Industrial Applications to Realize Decarbonization

Ikuya Kawasaki

President,




Infineon Technologies Japan K.K.

Yaskawa's Initiatives on Power Conversion Technologies toward the Realization of Carbon Neutral

Tatsuya Yamada

Senior Executive Officer, General Manager, Drives Div.,



Yaskawa Electric Corp.

AIST's R&D of 3DIC Technology in National Projects

 

Katsuya Kikuchi

Research Team Leader, 3D Integration Technology Research Team, Advanced Semiconductor Research Center

National Institute of Advanced Industrial Science and Technology (AIST)

2.5D/3D Advanced Package Platform Guide

 

TaeKyeong Hwang

R&D, VP,




Amkor Technology Inc.

 

Advanced Package for AI


 

Daniel Ng

Advanced Technology, PMTS Packaging Engineering,



Advanced Micro Devices, Inc.

 

Development of 2.3D Large Package with Panel Level Technology for HPC/AI

 

Lee Jeongho

Products Development Team, Project Leader, (Principle Engineer),


Samsung Electronics Co., Ltd.

 



West Halls

Exhibitions held inside West Halls

・10th WEARABLE EXPO
・FACTORY INNOVATION Week Tokyo 2024
・3rd SMART LOGISTICS Expo

East Halls

Exhibitions held inside East Halls

・NEPCON JAPAN 2024
・16th AUTOMOTIVE WORLD 2024