Exhibitors’ Presentation

Exhibitors will introduce their featured products and technologies in a seminar format.
The seminar is free of charge and no prior registration is required.
It will be held within the exhibition hall. Please make sure to complete your visitor registration for entry to the exhibition in advance.

<Exhibitors’ Product/Technology Seminar ~New Tech Trend~>

Promote automation by Bridgestone softrobotics

Bridgestone Softrobotics Ventures 

Introducing soft robot hand "TETOTE", that can grasp objects of various shapes and sizes, along with use cases.

Jan. 22 (Wed)  14:00 - 14:30

RoboDEX

Suction tape removal machine for SMT parts, Drying furnace

Rexxam CO., LTD.

We will introduce our new machine that removes the suction tape on SMT parts and our new space-saving drying furnace.

Jan. 22 (Wed)  15:00 - 15:30

ELECTROTEST JAPAN

Coming soon

Seino Information Service CO., LTD.

Coming soon

Jan. 22 (Wed)  15:00 - 15:30

SMART LOGISTICS Expo

Plasma joining for aluminum casting & high-tensile steel

STANLEY Engineered Fastening 

How plasma joining for multi-material can transform EV production

Jan. 23 (Thur) 11:00 - 11:30

EV JAPAN

Seminar on UNECE R10.07 (Latest Version)

TUV Rheinland Japan LTD.

EMC Regulations for Automotive Products, UNECE R10.07 Draft Revision Points will be explained

Jan. 23 (Thur) 12:00 - 12:30

EV JAPAN

Regulatory Trends in AI, autonomous driving and Charging

TUV Rheinland Japan LTD.

AI Regulatory Law to be Promulgated in 2024, AI Law in Vehicle Automation, autonomous Driving and Charging

Jan. 23 (Thur) 13:00 - 13:30

EV JAPAN

High Reliability Materials for Power Semiconductor Module

Resonac CORP.

Introduction of High Reliability Materials for Power Semiconductor Modules Under The Increasing Trend of Power Density

Jan. 23 (Thur) 13:00 - 13:30

POWER DEVICE & MODULE EXPO

TLP ensures high-temperature operation of SiC

Senju Metal Industry CO., LTD.

We have developed a TLP bonding material that exhibits high heat resistance. We will introduce its features.

Jan. 23 (Thur) 14:00 - 14:30

CAR-ELE JAPAN

Uncertainty Quantification (UQ) for Reliable AI Predictions

Keisoku Engineering System CO., LTD.

UQ provides probabilistic methods for integrating real/simulated data and assessing AI prediction reliability.

Jan. 23 (Thur) 14:00 - 14:30

POWER DEVICE & MODULE EXPO

Coming soon

Seino Information Service CO., LTD.

Coming soon

Jan. 23 (Thur) 14:00 - 14:30

SMART LOGISTICS Expo

New Product Introduction & i 4.0 Concept of Manufacturing

VTech Communications LTD.

NPI New Product Introduction provides samll QTY production and introduce Concept of Industrial 4.0 in Manufacturing

Jan. 23 (Thur) 15:00 - 15:30

PWB EXPO

AI-powered BMS for better, safer and greener batteries

Eatron Technologies LTD.

Discover how AI-powered BMS can revolutionize battery performance, safety, and longevity for a greener future.

Jan. 23 (Thur) 15:00 - 15:30

SOFTWARE-DEFINED VEHICLE EXPO

Best-in-Class Blind Rivet Nut for IPX7 and Automation

STANLEY Engineered Fastening 

POP Nut Mech Seal eliminates O-Rings, simplifies assembly, and meets IPX7 standards for high-strength application

Jan. 24 (Fri) 11:00 - 11:30

EV JAPAN

increasing manufacturing output by advanced technology

Applied Materials INC.

Applied Materials shares manufacturing automation use cases in the semiconductor industry. Topics include cloud and AI.

Jan. 24 (Fri) 12:00 - 12:30

SMART FACTORY Expo

Introducing non-pressure sinter paste for copper substrates.

NIHON HANDA CO., LTD.

Introducing "MAX4022", a non-pressure high-strength sinter paste, plus time-saving products "MAX534" and "MAX5342".

Jan. 24 (Fri) 13:00 - 13:30

IC & SENSOR PACKAGING EXPO

Transform site with planning! Is your lead time appropriate?

BitQuark CO., LTD.

Learn how to optimize lead times by revising production plans and process design with a production simulator.

Jan. 24 (Fri) 13:00 - 13:30

SMART FACTORY Expo

Electronics is the key to manage vehicle's carbon footprint

ACTIA Japan K.K.

ACTIA introduces EcoMatrix provides assessment of Electronics product's ecological impact, especially carbon emissions.

Jan. 24 (Fri) 14:00 - 14:30

CONNECTED CAR JAPAN

Turning logistics data into power - Conata case study

FLYWHEEL INC.

How can logistics data drive management and decisions? Explore the future of logistics warehouses via the KDDI case.

Jan. 24 (Fri) 14:00 - 14:30

SMART LOGISTICS Expo

Coming soon

Seino Information Service CO., LTD.

Coming soon

Jan. 24 (Fri) 14:00 - 14:30

SMART LOGISTICS Expo

\Check Exhibitor Details/

\200+ Free Conference/

\for smooth entry/

\for those above manager/